Aylight closes €4.5M pre-seed round to advance optical interconnect technology
Summary
Zürich-based deeptech startup Aylight has secured €4.5 million in a pre-seed funding round to advance its chip-scale multiwavelength laser technology. Founded in 2025 by Bahareh Marzban and Dmitry Kazakov, the company's innovation generates multiple precisely spaced wavelengths from a single chip, utilizing a frequency-modulated comb architecture compatible with existing semiconductor photonics foundries. This funding, co-led by Elaia and Swisscom Ventures with participation from Verve Ventures and Plug and Play, will support the development of semiconductor-foundry prototypes and expand its R&D team. Aylight's technology addresses critical laser constraints in scaling AI infrastructure, enhancing optical interconnects for data centers and enabling high-precision frequency-modulated continuous-wave (FMCW) sensing, semiconductor inspection, metrology, industrial automation, and precision robotics.
Key takeaway
For AI Architects designing next-generation data centers, Aylight's chip-scale multiwavelength laser technology signals a critical shift. You should evaluate how this innovation, by reducing reliance on multiple discrete lasers, could alleviate current optical interconnect bottlenecks. Consider its potential to enhance data transfer efficiency and support escalating AI workload demands, impacting future infrastructure planning and hardware procurement.
Key insights
Chip-scale multiwavelength lasers can resolve AI infrastructure scaling constraints by improving optical interconnect efficiency.
Principles
- AI infrastructure scaling demands efficient optical interconnects.
- Single-chip multiwavelength generation reduces discrete laser needs.
- Problem-first approach guides technology development.
Method
Aylight's method involves developing chip-scale multiwavelength lasers based on a frequency-modulated comb architecture, designed for manufacturing in existing semiconductor photonics foundries.
In practice
- Improve AI data center optical interconnects.
- Enhance high-resolution 3D sensing in robotics.
- Streamline semiconductor inspection processes.
Topics
- Optical Interconnects
- Multiwavelength Lasers
- AI Infrastructure
- Semiconductor Photonics
- FMCW Sensing
- Deeptech Funding
Best for: Investor, Entrepreneur, AI Architect
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Editorial summary, takeaway, and curation by AIssential. Original article published by Tech.eu - Tech.eu.